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GA5061VF

FEATURES ・High Output Power: Pout=34.0dBm (MAX.) ・High Linear Gain: GL=27.0dB (typ.) ・Broad Band: 9.5~13.5GHz ・Impedance Matched Zin/Zout=50Ω ・Small Hermetic Metal-Ceramic Package(VF) DESCRIPTION The GA 5061VF is a MMIC amplifier that contains a three-stage amplifier, internally matched, for standard communications band in the9.5 to13.5GHz frequency range.

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ABSOLUTE MAXIMUM RATING

Item	Symbol	Condition	Rating	Unit
Drain-Source Voltage	VDD		10	V
Gate-Source Voltage	VGG		-7	V
Input Power	Pin		26	dBm
Channel Temperature	Tch		+175	℃
Storage Temperature	Tstg		55~125	℃

RECOMMENDED OPERATING CONDITION

Item	Symbo	Condition	Rating	Unit
Drain-Source Voltage	VDD		6	V
Gate-Source Voltage	VGG		-5	V
Input Power	Pin		≤12	dBm
Operating Case Temperature	TC		-40~+85	℃

ELECTRICAL CHARACTERISTICS (Case Temperature TC =25oC)

Item	Symbol	test Condition	Limits			Unit
Item	Symbol	test Condition	Min.	Typ.	Max.	Unit
Frequency Range	f	VDD=6V VGG=-5V Zs=Zl=50ohm 1:f=9.5~11.7GHz 2:f=11.7~13.3GHz 3:f=10MHz , 2-Tone Test, Pout=19dBm S.C.L. ~ 199 V*	9.5	-	13.5	GHz
Output Power at 1dB G.C.P	P1dB		311 292	331 312	- -	dBm
Power Gain at 1dB G.C.P.	G1dB		241 222	261 242	- -	dB
Power-added Efficiency at 1dB G.C.P	add		- -	211 152	- -	%
Third Order Intermodulation*	IM3		-42*3	-45*3	-	dBc
Drain Current at 1dB G.C.P	IDD		- -	17001 15002	24001 24002	mA mA
Gate Current	IGG		-	25	-	mA
Input Return Loss (at Pin=-20dBm)	RLin		-	-8	-	dB
Output Return Loss (at Pin=-20dBm	RLout		-	-8	-	dB
ESD	Class 0

Package Out Line

1.Screw Mounting

(1)The flange of package may be attached using screws. Torque conditions are shown in table 1.

Table 1. Recommended and Maximum Torque for Screw Mounting

Package	Recommended screw	Recommended Torque	Maximum Torque
VF	M2.0	10 N-cm (0.9 lb-in)	15 N-cm (1.3 lb-in)

(2)First, tighten the screws with a torque driver set to 5 N-cm.

(3)The surface finish of the heat sink should be better than 0.8 m, and the surface flatness must be better than 10 m.

(4)Silicon based heat sink compounds should not be used for thermal conductive grease. They cause poor grounding of the source flange, contamination and long term degradation of thermal resistance between the FET package and heat sink.

2.Solder Mounting

(1)Recommended solder are Tin-Lead solder (63Sn/37Pb), Lead-Free solder (Sn-3.0Ag-0.5Cu)*1 or equivalent.

(2)For soldering, Tin-Lead solder (63Sn/37Pb) or Lead-Free solder (Sn-3.0Ag-0.5Cu)*1 shall be used. (*1: The figure displays with weight %. A predominantly tin-rich alloy with 3.0% silver and 0.5% copper.)

(3)Recommended Flux is Rosin type with chlorine content: 0.2% or less and a low halogen content. After soldering, the flux residue should be removed by appropriate cleaning methods.

(4)The recommended soldering conditions are as follows: Partial heating method (soldering iron, spot laser/air) Product terminal temperature: 260 deg-C, max. 10 s./terminalor 400 deg-C, 。max. 3 s./terminal.

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